RIBER EZ-CURVE Vacuum Device In-situ Warping Monitor
An in-situ monitor that measures wafer stress, warpage, curvature, anisotropy, etc., in various vacuum devices in real-time and with high precision.
The EZ-CURVE developed by RIBER is an in-situ monitor that can be attached to various vacuum devices and is capable of measuring stress, warping, curvature, anisotropy, and more. Features: 1) Capable of measuring in-situ stress, warping, curvature, anisotropy, etc. 2) Can also be used to obtain basic data on growth mechanisms. 3) Compatible with various vacuum deposition devices (CVD, MBE, PVD, etc.) and vacuum process equipment (etching, annealing, etc.). 4) Compared to conventional laser reflection measurement methods, this instrument achieves over 10 times the sensitivity for warping measurement and a high measurement frequency (100Hz). 5) Compatible with low lattice mismatch material systems such as AlGaAs/GaAs. 6) Capable of handling thick wafers up to several millimeters. 7) Achieves high stability and alignment-free measurement. 8) Uses a white light source, unaffected by changes in reflectivity, and does not require adjustment of exposure time. 9) Does not affect the flatness of the wafer and can measure patterned wafers. 10) Capable of sharing data with other software. Specifications: 1) Curvature measurement range: 0.0008 to 200,000 Km-1 2) Radius range (Max-Min): 1,250,000 to 0.005m
- Company：伯東 本社
- Price：Other
